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Pepperl + Fuchs introduces RL31-8-H-800 Multi-Pixel Array Sensors

Source: Pepperl+Fuchs
14 August, 2011
Multi-pixel array sensors have a sensing distance up to three times that of similarly sized sensors, and can reliably and consistently detect objects of varied colors.

August 14, 2011 - Pepperl+Fuchs introduces RL31-8-H-800 Multi-Pixel Array Sensors, which have a sensing distance up to three times that of similarly sized sensors, can reliably and consistently detect objects of varied colors without requiring any adjustments or the need to “re-teach,” and quickly and easily adapt to multiple and evolving application requirements. The result is a powerful and highly flexible solution that provides the simplicity of a single-switch point photoelectric sensor, but with the adaptability of a laser distance measurement device. The multi-pixel array design enables the RL31-8-H-800 series to be highly insensitive to object color.

These sensors detect white and black test objects to less than 5 percent difference of each other even over the entire specified sensing range. Competitive models can see wildly varying ranges up to 33% or even 40% variance in sensing distance. IO-Link technology enables the RL31-8-H-800 series to deliver an extremely high level of sensing flexibility. IO-Link configuration is an efficient and cost-effective way to customize sensors for their particular task.

It enables users to configure more than twelve different specifications to suit specific application needs – that flexibility is a definitive difference over competitive models, even compared with those that are IO-Link enabled. cULus listed RL31-8-H-800 multi-pixel array sensors can be used with the simplicity and precise discrete switching of a background suppression sensor, or for the flexible, higher level measurement sensing commonly reserved for laser distance measurement sensors.

This versatility makes them ideally suited to satisfying the demanding power, performance and flexibility needs of a wide range of material handling, packaging, printing and automotive applications, among others, including presence checking, trigger sensing, stack height detection, tension checking, web break monitoring and fill level monitoring.

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