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Teledyne DALSA introduces BOA Spot vision sensor

By: Teledyne
26 January, 2016
Teledyne DALSA introduces BOA Spot vision sensor
Teledyne DALSA introduces BOA Spot vision sensor
The sensors combine a BOA vision system with integrated LED lighting, lens cover, and easy-to-use software.

January 26, 2016 – Teledyne DALSA announced BOA Spot vision sensors that combine the power and flexibility of a BOA vision system with integrated LED lighting, lens cover, and easy-to-use software to deliver high value capabilities at a low cost of ownership. Available with 640 x 480 or 1280 x 960 image resolution, BOA Spot vision sensors can inspect multiple part features at the same time, at higher speeds and with greater accuracy than traditional photoelectric sensors. Embedded vision tools for part locating, feature finding, counting and measuring applications, offer a simple graphic user interface and can be combined and used numerous times to solve simple or complex inspection tasks.

And its robust build quality with IP67 rating means Spot is at home in harsh industrial/wash down conditions.

Inspections using BOA Spot vision sensors can be triggered by parts in motion or from a PLC after being moved into a stationary position. Standard factory protocols, such as Ethernet/IP and PROFINET, are directly supported for communicating with 3rd party equipment or the factory enterprise.

Thru- and surface-mounting options and a slim form factor lend automation and system developers the benefit of positioning the BOA Spot in tight places.

“Adding vision to your manufacturing process is simple and affordable with our new BOA Spot vision sensors,” commented Steve Geraghty, Vice-President,Industrial Vision Solutions at Teledyne DALSA. “This latest BOA series is quick to setup and capable of communicating with a broad range of factory devices, making it an easy choice for companies looking to expand their automation with vision.”

About Teledyne DALSA, Inc.

Teledyne DALSA, a Teledyne Technologies company, is an international leader in high performance digital imaging and semiconductors. The company designs, develops, manufactures and markets digital imaging products and solutions, in addition to providing specialized semiconductor products and services including MEMS.

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