Dec. 5, 2023 - Teledyne DALSA is pleased to announce its Xtium2-XGV PX8 , a GigE Vision compatible image acquisition board that features a real-time depacketization engine to convert GigE Vision image packets into ready-to-use images. It also has a hardware-assisted packet resend logic that improves the reliability of image transfers while reducing the CPU overhead. Xtium2-XGV PX8 targets image acquisition from single or multiple independent 10, 5, 2.5 or 1GigE Vision area scan cameras, line scan cameras, and 3D profile sensors.
Building on the field-proven technology and performance of Teledyne DALSA’s Xtium2 family of image acquisition boards, the new Xtium2-XGV PX8 is a half-length multi-port 10GigE frame grabber for PCI Express Gen 3.0 x8 platforms. It can support up to 32 cameras in a variety of different link-speeds and scanning configurations. Available in a four or two port SFP+ configurations, the Xtium2-XGV PX8 can sustain aggregate input bandwidth of 4 GByte/s (4x10 Gb/s) and up to 6.8 GBytes/sec output bandwidth to the host memory.
It can also perform a variety of on-board format conversions like Bayer to RGB, Bi-colour to RGB, etc. before sending the images to the host computer. For a more reliable GigE vision system, Xtium2-XGV supports hardware assisted packet resend and action command for external event synchronization. It is also capable of transmitting/re-transmitting IEEE-1588 messages without requiring an external switch. Xtium2-XGV supports Sapera LT and Teledyne FLIR IIS’ Spinnaker SDKs .
See a live demo of Xtium2-XGV PX8 at the International Technical Exhibition on Image Technology and Equipment (ITE) , Yokohama, Japan 6-8 December 2023. Visit us on Teledyne stand D-04 or contact us online for more information.
