July 3, 2012 – DFI announces the CR908-B, a COM Express Compact module based on the new Mobile Intel QM77 Express chipset. This Type 6 module supports the 3rd generation Intel Core processors in BGA 1023 package. The supported processors are built on Intel’s 22-nanometer process technology and boast a 15% greater CPU performance over the previous generation processors. These processors also offer higher performance at lower power consumption than the 2nd generation processors which are also supported on these module boards.
The Intel HD Graphics 4000 engine integrated into the processors delivers up to 50% 3D graphics performance improvement and up to 1.8x HD to HD transcode performance increase. The Intel Clear Video HD Technology provides advanced imaging capability for Blu Ray and other high definition video processing. Graphics APIs include DirectX 11, and OpenGL 3.1.
CR908-B brings enhanced graphics performance by supporting 3 independent displays in any combination of VGA, LVDS and DDI (HDMI, DVI, and DisplayPort). The low power module boards take full advantage of the Mobile Intel QM77 Express chipset which is packed with high performance I/O capabilities to provide increased mobile computing and graphics performance. With the new USB 3.0, it allows a system to process more data load.
It provides 4 USB 3.0/2.0, 4 USB 2.0, 2 SATA 3.0 ports with speed up to 6Gb/s, 2 SATA 2.0 ports with speed up to 3Gb/s, 1 SMBus, 1 I2C, and 4-bit input and 4-bit output GPIO for device controls.
The board offers additional expansion capability via 1 PCIe x16 slot for video capture card, and 1 PCIe x4 and 3 PCIe x1 or 7 PCIe x1 slot.
Features:
- COM Express Compact (95mm x 95mm)
- 3rd generation Intel Core processors (BGA)
- Intel Core i7-3615QE (6M Cache, up to 3.3GHz); 45W
- Intel Core i7-3612QE (6M Cache, up to 3.1GHz); 35W
- Intel Core i7-3555LE (4M Cache, up to 3.2GHz); 25W
- Intel Core i7-3517UE (4M Cache, up to 2.8GHz); 17W
- Intel Core i5-3610ME (3M Cache, up to 3.3GHz); 35W
- Mobile Intel QM77 Express chipset
- 1 DDR3/DDR3L 1066/1333/1600MHz SODIMM up to 8GB
- VGA, LVDS and DDI (HDMI, DVI, and DisplayPort) supports up to 3 independent displays
- 1 Intel Gigabit LAN controller
- 4 USB 3.0/2.0
- 4 USB 2.0
- 2 SATA 3.0 (6Gb/s)
- 2 SATA 2.0 (3Gb/s)
- 4-bit input and 4-bit output GPIO
- 1 PCIe x16
- 1 PCIe x4 and 3 PCIe x1 or 7 PCIe x1
The mobile embedded module board is ideal for applications requiring a stable revision-controlled platform, such as embedded applications.
About DFI
Established in 1981, DFI is a leading supplier of high-performance computing technology worldwide. With more than 30 years of experience, DFI focuses on innovative design and manufacture of leading-edge board and system level products for embedded applications requiring strict revision control and long life availability. DFI uses the latest technology platforms and manufacturing techniques to produce cost-effective products for use in medical diagnostic & imaging, A/POS, industrial control, kiosk, security & surveillance, digital signage, gaming, and other embedded applications.
As an Associate member of the Intel Intelligent Systems Alliance, DFI works closely with Intel on development of next-generation standards-based building blocks, platforms and solutions for the communications and embedded market segments.
