January 14, 2016 - Micro-Measurements releases S5056, S5020, S5046, and S5047 full-bridge strain gages that offer grid-resistance tolerance and grid-to-grid temperature matching.
Offering several advantages over bonding multiple, individual strain gages, the devices are now available with smaller, higher resistance patterns to serve a variety of bending and torque/shear applications.
Micro-Measurements offers a wide range of pattern configurations and resistance ranging from 350 Ω to 20 kΩ. The addition of gold-plated solder pads improves lead wire attachment and solder-joint reliability, reducing the chances of solder pad oxidation prior to attaching the lead wires.
Compared to bonding multiple individual strain gages, the full-bridge devices provide simplified, more precise alignment and reduced bonding operations. All four active arms of the Wheatstone bridge circuit are formed on a single carrier, allowing the entire bridge to be bonded at one time. All intra-bridge connections are integrated into the pattern, thus eliminating intra-bridge soldering.
Micro-Measurements sensors are available in a variety of sizes, configurations, and mounting technologies.
