August 27, 2015 – SICK announced Dx50-2 PRO distance sensor featuring a High-Definition Distance Measurement (HDDM) platform that provides greater precision at longer sensing distances.
Dx50-2 sensors provide precise and reliable measuring of ranges up to 10 m on black targets and up to 30 m on white targets, and the sensors deliver up to 3,000 distance values per second for maximum throughput and process quality. In addition, a rugged housing that meets both IP 65 and IP 67 enclosure ratings, wide operating temperature from –40 °C to +65 °C, and ambient light immunity ensure reliable operation in harsh conditions. Dx50-2 sensors also feature an intuitive display and easy teach option, saving time during installation and commissioning.
Settings for speed, sensing range, and repeatability can be adjusted to meet current requirements, allowing Dx50-2 sensors to be customized for a wide variety of applications, including detection and measurement of hot materials in the metal and steel industry, collision avoidance in container ports, and positioning of robots in the automobile industry.
About SICK
SICK is one of the world’s leading manufacturers of sensors, safety systems, machine vision, encoders and automatic identification products for industrial applications. With more than 1000 patents, SICK continues to lead the industry in new product innovations. The diversity of its product line allows SICK to offer solutions at every phase of production in the logistics, automotive, packaging, electronics, food and beverage, and material handling markets. SICK AG was founded in 1946 and has operations or representation in 65 countries worldwide.
