Articles and News
34 Results Found
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Siemens Wins Best of Show Award for 'Packaging: Design' at 2026 Chiplet Summit
Siemens’ Innovator3D IC software was recognized for advancing 2.5D and 3D chiplet integration. -
SEMI Reports 2025 Annual Worldwide Silicon Wafer Shipments and Revenue Results
Silicon wafer shipments increased in 2025 amid strong AI-driven demand, while revenue softened. -
Siemens Acquires Canopus AI to Bring AI-Based Metrology to Semiconductor Manufacturing
The acquisition extends Siemens’ comprehensive EDA software portfolio with computational metrology and inspection to help chipmakers solve critical technical challenges in semiconductor manufacturing. -
Robot Orders Grow 6.6% in 2025 as General Industries Drive Broader Automation Adoption
New A3 data highlights non-automotive sector gains, a strong Q4 finish and nearly 20% share for collaborative robots. -
KUKA México to Celebrate 30th Anniversary in 2026
2026 will mark a significant milestone for KUKA México, a prominent leader in advanced automation solutions. -
How Semiconductor Policy Could Undermine US Motion Control Market Momentum
Semiconductor investment is a critical driver for industrial automation and motion control. -
Nordson Electronics Solutions to Showcase Printed Circuit Board Assembly, Semiconductor Packaging Equipment at Two Tradeshows in China
Nordson Electronics Solutions is pleased to announce they will showcase many new dispensing, conformal coating, selective soldering, and surface treatment products and technologies at two events: Productronica China and SEMICON China, both held at the Shanghai New International Expo Centre, Shanghai, China, March 17-20, 2021. -
Fuji America chooses Saki's automated optical inspection system
Saki's inspection and measurement systems will be used to ensure that the printed circuit boards produced at Fuji adhere to the standards of quality and reliability. -
Video describes Honeywell SMART Position Sensor
The video highlights the sensor's ability to improve safety, operational efficiency, reliability, and durability, and reduce total cost of ownership.







