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Smooth. Seamless. Smart. Meet GOT3000.
Faster startup, clearer visuals, built in OPC UA and VPN. GOT3000 HMIs help reduce downtime and simplify smart factory integration. -
2026 State of Industrial AI Report for Manufacturing
Cisco's 2026 State of Industrial AI Report, surveying 350+ manufacturing professionals across 19 countries, explores how firms adopt AI, secure networks and scale operations.
1,202 Products
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YXLON introduces FF70 CL X-ray inspection systems
The range is being introduced during the Semicon China exhibition in Shanghai, March 20-22, 2019, booth #2439 – with a live presentation of the YXLON FF70 CL. -
Gardasoft announces FP200 series of lighting controllers
The FP200 series of controllers combine capabilities for high frequency, high power LED pulsing with low output current performance. -
JAI introduces Sweep+ SW-4000T-10GE line scan camera
JAI introduced an industrial color line scan camera in the Sweep+ Series. The Sweep+ SW-4000T-10GE is a prism-based color line scan camera equipped with three CMOS sensors and a 10 GigE interface including backwards compatibility to 5, 2.5 and 1 Gbps Ethernet standards -
Hexagon’s Manufacturing Intelligence division introduces DPA Industrial, featuring C1 Camera
The overall DPA Industrial system is a fully portable coordinate measuring system that works over measurement volumes of up to 10 meters diagonal and delivers digital models to an accuracy of within 10 microns. -
e-con introduces Hyperyon HDR USB UVC camera
The 2 MP Ultra low light HDR USB UVC camera has a built-in H.264/MJPEG compression based on SONY STARVIS series 1/2.8” IMX290 CMOS image sensor -
SPECTRO announces SPECTROGREEN plasma optical emission spectrometry (ICP-OES) analyzer
The SPECTROGREEN analyzer is designed for routine analyses in environmental and agronomy applications as well as consumer product safety, pharmaceuticals, petrochemicals, chemicals, and foods. -
EVT introduces Merkur camera series
The Merkur ZLS has a FPGA and an IP Core to program the FPGA. The Dual Core ARM processor can also be extended with the Myriad 2 Deep Learning processor. -
Mikotron introduces EoSens camera series
Mikrotron will introduce a suite of cameras at the SPIE Photonics West, taking place February 5-7, 2019, in San Francisco, CA, at the Moscone Center. -
e-con Systems announces e-CAM130_CUXVR, Multiple 4K camera support for NVIDIA Jetson AGX Xavier Developer kit
NVIDIA Jetson AGX Xavier has support for 4x 4 lane MIPI CSI-2 interface.e-CAM137_CUMI1335_MOD can stream uncompressed video 4K @ 30fps. The e-CAM130_CUXVR, supports up to 4 simultaneous synchronized 4K @ 30fps streams. -
Pixelink releases PL-D755MU-POL polarization camera
The 5.1 megapixel camera takes advantage of on-chip polarizing filters enabling greater fault detection on reflective surfaces such as metal, plastic and glass, previously undiscernible with standard sensors. -
Basler announces Vignetting Correction feature for correction of edge shadowing
Vignetting Correction is a feature from Basler that corrects the described unwanted effect in a unique way. After a one-time calibration of the camera, there are no negative effects on frame rate or image quality as the correction values are stored in the camera and automatically taken into account in the image output. -
Thorlabs announces VEG210C1 and VEG220C1 imaging systems
Based on Thorlabs’ MEMS‐VCSEL swept‐wavelength laser source technology, these systems are available in both 100 kHz (VEG210) and 200 kHz (VEG220) variants. -
Basler introduces dart BCON for MIPI Development Kit
The development kit consists of a dart BCON for MIPI camera module with a 5 megapixel resolution, a developer processing board based on a Qualcomm Snapdragon 820 SoC, a 96boards.org-compatible mezzanine board and the necessary accessories, such as lens and cables, with which users can start and test their system structure. -
Larson Electronics releases GL-3349-M-WR thermal infrared imaging camera system
This camera has a 1500’ detection range, two speeds and a 2.4GHz transmitter, providing operators with a non-contact instrument to scan and visualize machinery and electrical equipment temperature distribution in military, manufacturing and other industrial applications. -
IDS introduces Ensenso XR stereo camera
The Ensenso XR stereo camera from IDS can calculate 3D point clouds itself. Afterwards, it transmits the data via Gigabit Ethernet or WiFi to a host PC for further analysis. -
e-con Systems announces See3CAM_CU55 5MP USB 3.0 Camera
With S-mount lens holder, the See3CAM_CU55 is suitable for applications such as smart surveillance, digital microscopy, document scanning cameras, optical character recognition, smart parking lot management, microscopy/magnification, drones etc. -
FocalSpec announces LCI401 and LCI1201 3D imaging sensors
These sensors are specifically designed to meet the needs of system integration. The SDK including C+, C++, C#, Halcon, LabVIEW, OpenCV, Python and MATLAB assists application development. -
JAI introduces SP-12401-USB, a 12.4-megapixel camera
The cameras are equipped with a standard USB3 Vision interface capable of running at 23.4 frames per second for 8-bit monochrome or raw Bayer images at full resolution (4112 x 3008 for monochrome and 4088 x 3000 for color). Power and triggering can be supplied via a separate 12-pin connector. -
Aerotech releases GL4 scanner controller
The GL4 uses interpolation electronics to provide up to 26-bits of effective resolution while onboard real-time 2D calibration ensures accurate beam placement over the entire field of view. -
Marktech Optoelectronics introduces Model MTPD1346D-xx series of InGaAs/InP broadband PIN photodiodes
Typical applications include aerospace, automation, autonomous vehicles, high-speed communications, industrial controls, LIDAR, medical, material and chemical analysis, security, and wearables, among others.
